Invention Application
- Patent Title: IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING
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Application No.: US18783688Application Date: 2024-07-25
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Publication No.: US20240405005A1Publication Date: 2024-12-05
- Inventor: Yu-Chia Lai , Cheng-Chieh Hsieh , Tin-Hao Kuo , Hao-Yi Tsai , Chung-Shi Liu , Chen-Hua Yu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L21/56 ; H01L23/00 ; H01L23/31 ; H01L23/40
Abstract:
A package includes a first package and a second package over and bonded to the first package. The first package includes a first device die, and a first encapsulant encapsulating the first device die therein. The second package includes an Independent Passive Device (IPD) die, and a second encapsulant encapsulating the IPD die therein. The package further includes a power module over and bonded to the second package.
Information query
IPC分类:
