Invention Application
- Patent Title: STANDOFF-SPRING COMBINATION FITTING FOR THERMAL SOLUTIONS
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Application No.: US18824590Application Date: 2024-09-04
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Publication No.: US20240431061A1Publication Date: 2024-12-26
- Inventor: Alonso Rodriguez Chacon , Arturo Navarro Alvarez , Jeff Ku
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H05K7/14
- IPC: H05K7/14 ; H05K1/02

Abstract:
Example fittings that combine standoffs and springs for supporting thermal solutions are disclosed herein. An example electronic device includes a chassis; a substrate; a thermal solution; and a fitting to separate the substrate from the chassis and to separate the thermal solution from the substrate, the fitting including a standoff end and a spring end.
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