Thermally de-bondable adhesives are formed from curable compositions that have a two-stage curing mechanism. The first stage of curing forms a pressure sensitive adhesive and the second stage of curing, reduces the adhesion of the adhesive. The curable composition includes a curable composition and a thermally de-bonding composition. The curable composition includes a first alkyl (meth)acrylate monomer with 4-12 carbon atoms, a second hydroxyl-functional (meth)acrylate monomer, a crosslinker, and an initiator. The thermally de-bonding composition includes a blocked multi-functional isocyanate, and a metal salt catalyst. The Peel Adhesion of the cured adhesive upon heating to at least 180° C. for 1 hour is reduced by at least 15%.