公开(公告)号：US20250059408A1

公开(公告)日：2025-02-20

申请号：US18721284

申请日：2022-12-01

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jian-Kuan Wu ,  Shujun J. Wang ,  Aizoh Sakurai

IPC: C09J7/38 ,  C09J5/06 ,  C09J11/06

Abstract: Thermally de-bondable adhesives are formed from curable compositions that have a two-stage curing mechanism. The first stage of curing forms a pressure sensitive adhesive and the second stage of curing, reduces the adhesion of the adhesive. The curable composition includes a curable composition and a thermally de-bonding composition. The curable composition includes a first alkyl (meth)acrylate monomer with 4-12 carbon atoms, a second hydroxyl-functional (meth)acrylate monomer, a crosslinker, and an initiator. The thermally de-bonding composition includes a blocked multi-functional isocyanate, and a metal salt catalyst. The Peel Adhesion of the cured adhesive upon heating to at least 180° C. for 1 hour is reduced by at least 15%.