Invention Application
- Patent Title: PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PATTERNS USING A PHOTORESIST COMPOSITION
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Application No.: US18777777Application Date: 2024-07-19
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Publication No.: US20250093772A1Publication Date: 2025-03-20
- Inventor: Chawon Koh , Hyo Jae Yoon , Tsunehiro Nishi , Gayeong Lim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2023-0124247 20230918
- Main IPC: G03F7/004
- IPC: G03F7/004 ; C07F7/22
Abstract:
The present invention relates to PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PATTERNS USING A PHOTORESIST COMPOSITION. Disclosed is a photoresist composition including an organometallic compound including a ring including a metal, a first heteroatom coordinated to the metal, and a second heteroatom covalently bonded to the metal, and an aromatic ring substituted or fused to the ring; and a solvent.
Information query
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