公开(公告)号：US20250093772A1

公开(公告)日：2025-03-20

申请号：US18777777

申请日：2024-07-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chawon Koh ,  Hyo Jae Yoon ,  Tsunehiro Nishi ,  Gayeong Lim

IPC: G03F7/004 ,  C07F7/22

Abstract: The present invention relates to PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PATTERNS USING A PHOTORESIST COMPOSITION. Disclosed is a photoresist composition including an organometallic compound including a ring including a metal, a first heteroatom coordinated to the metal, and a second heteroatom covalently bonded to the metal, and an aromatic ring substituted or fused to the ring; and a solvent.