Invention Application
- Patent Title: BLOCK COPOLYMERS AND METHODS OF MANUFACTURING INTEGRATED CIRCUIT DEVICES USING THE SAME
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Application No.: US18824037Application Date: 2024-09-04
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Publication No.: US20250101145A1Publication Date: 2025-03-27
- Inventor: Changhyeon An , Yeonsik Jung , Yemin Park , Jeehyun Hong , Youngseog Kang , Changmin Park , Kwangsub Yoon , Jisun Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2023-0129560 20230926
- Main IPC: C08F8/32
- IPC: C08F8/32 ; C08F293/00 ; H01L21/027 ; H01L21/308

Abstract:
A block copolymer is described, such as one including a first polymer block and a second polymer block that have different structures, wherein the first polymer block includes a first unit derived from an acrylic acid ester, and the second polymer block includes an inorganic material-containing random block, in which a second unit including an inorganic material-containing group and a third unit that is devoid of an inorganic material-containing group are connected to each other to provide a concentration gradient. Also described are methods of manufacturing an integrated circuit device that include forming, on a feature layer, a block copolymer layer including the block copolymer as set forth above; phase-separating the block copolymer layer to form a structure that includes a plurality of first domains that each include the first polymer block, and at least one second domain including the second polymer block; removing the plurality of first domains; and etching the feature layer using the at least one second domain as an etch mask.
Information query
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