Invention Application
- Patent Title: POLISHING COMPOSITIONS AND METHODS OF USE THEREOF
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Application No.: US18889658Application Date: 2024-09-19
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Publication No.: US20250101263A1Publication Date: 2025-03-27
- Inventor: Eric Turner , Changhong Wu , Bin Hu , Hyosang Lee
- Applicant: Fujifilm Electronic Materials U.S.A., Inc.
- Applicant Address: US RI N. Kingstown
- Assignee: Fujifilm Electronic Materials U.S.A., Inc.
- Current Assignee: Fujifilm Electronic Materials U.S.A., Inc.
- Current Assignee Address: US RI N. Kingstown
- Main IPC: C09G1/02
- IPC: C09G1/02 ; H01L21/321

Abstract:
The present document relates to a polishing composition that includes at least one abrasive, at least one pH adjuster, at least one guanamine compound, and water. The polishing composition can be used in a method of polishing a substrate including applying the polishing composition to a surface of a substrate and bringing a pad into contact with the surface of the substrate and moving the pad in relation to the substrate. The surface of the substrate can include tungsten and/or molybdenum.
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