Invention Application
- Patent Title: THREE-DIMENSIONAL MEMORY DEVICE
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Application No.: US18897719Application Date: 2024-09-26
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Publication No.: US20250142829A1Publication Date: 2025-05-01
- Inventor: SEUNGYEON KIM , IN HO KANG , SUKKANG SUNG , BEAKHYUNG CHO
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2023-0148250 20231031
- Main IPC: H10B43/40
- IPC: H10B43/40 ; G11C5/06 ; G11C16/04 ; G11C16/10 ; G11C16/26 ; H01L25/065 ; H10B41/27 ; H10B41/41 ; H10B43/27 ; H10B80/00

Abstract:
A memory device is provided. The memory device includes: a memory cell array implemented in a first chip; and a peripheral circuit implemented in a second chip and a third chip which overlaps the first chip along a vertical direction. The peripheral circuit includes: a first peripheral circuit implemented in the second chip and the third chip; a second peripheral circuit implemented in the second chip and including at least one high-voltage transistor; and a third peripheral circuit implemented in the third chip and including at least one low-voltage transistor. The first peripheral circuit includes: a first sub-peripheral circuit implemented in the second chip and including at least one high-voltage transistor; and a second sub-peripheral circuit implemented in the third chip and including at least one low-voltage transistor.
Information query