Invention Grant
- Patent Title: Copper plating
- Patent Title (中): 镀铜
-
Application No.: US20600238Application Date: 1938-05-04
-
Publication No.: US2287654APublication Date: 1942-06-23
- Inventor: WERNLUND CHRISTIAN J , LLOYD BENNER HARRY , RICHARD BAIR ROBERT
- Applicant: DU PONT
- Assignee: Du Pont
- Current Assignee: Du Pont
- Priority: US20600238 1938-05-04
- Main IPC: C25D3/40
- IPC: C25D3/40
Information query
