Invention Grant
- Patent Title: Copper electroplating and compositions therefor
- Patent Title (中): 铜电镀及其组成
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Application No.: US22567251Application Date: 1951-05-10
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Publication No.: US2677654APublication Date: 1954-05-04
- Inventor: CHESTER ALLAN E , IRWIN JOSEPH T
- Applicant: POOR & CO
- Assignee: Poor & Co
- Current Assignee: Poor & Co
- Priority: US22567251 1951-05-10; US58394356 1956-05-10
- Main IPC: C25D3/38
- IPC: C25D3/38 ; C25D3/40 ; C25D5/30
Information query
