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    COLD SPRAY AND ANODIZATION REPAIR PROCESS FOR RESTORING WORN ALUMINUM PARTS
    1.
    发明申请
    COLD SPRAY AND ANODIZATION REPAIR PROCESS FOR RESTORING WORN ALUMINUM PARTS 有权
    用于恢复铝合金部件的冷喷涂和阳极修复工艺

    公开(公告)号：US20100187119A1

    公开(公告)日：2010-07-29

    申请号：US12362081

    申请日：2009-01-29

    Applicant: Bruce Almond ,  George Golna ,  Calum Macintyre

    Inventor： Bruce Almond ,  George Golna ,  Calum Macintyre

    IPC: C25D5/30

    CPC classification number: C25D11/16 ,  C23C24/04 ,  C23C28/322 ,  C23C28/345 ,  Y02T50/67

    Abstract: A method for repairing an aluminum part having a worn portion is provided. In one embodiment, the method includes the steps of: (i) producing a first substantially non-porous coating over the worn portion utilizing a cold spray process wherein a powder mixture is propelled against the worn portion of the aluminum part, and (ii) anodizing the aluminum part to grow an aluminum oxide layer overlaying the first substantially non-porous coating. The powder mixture includes aluminum and an alloy media.

    Abstract translation: 提供了修复具有磨损部分的铝部件的方法。 在一个实施方案中，该方法包括以下步骤：（i）利用冷喷涂方法在磨损部分上产生第一基本上无孔的涂层，其中将粉末混合物推向铝部件的磨损部分，和（ii） 阳极氧化铝部分以生长覆盖第一基本无孔涂层的氧化铝层。 粉末混合物包括铝和合金介质。

    Process for plating a long span of metal with a metal layer
    3.
    发明授权
    Process for plating a long span of metal with a metal layer 失效
    用金属层电镀长跨金属的工艺

    公开(公告)号：US4492615A

    公开(公告)日：1985-01-08

    申请号：US486012

    申请日：1983-04-18

    Applicant: Jacques LeFebvre

    Inventor： Jacques LeFebvre

    IPC: C25D5/30 ,  C25D3/12 ,  C25D7/06 ,  C25D17/10 ,  C25D19/00 ,  C25D5/04 ,  C25D5/44

    CPC classification number: C25D7/0614

    Abstract: A process for the continuous, electrolytic plating of a long span of metal with a layer of metal, having a high line speed and low period of immersion in the electrolyte, and a device therefor. The span of metal is passed through a shaving drawplate, then through a metal plating solution to which an electric voltage is applied through a fluid electric connector comprising a solution of metal chloride, a fluoride and boric acid.The process is used to plate a metal with an adhesive metal layer, which provides both ductility to facilitate extrusion and low, non-evolving contact resistance.

    Abstract translation: 一种具有金属层的长跨度金属的连续电解电镀方法，具有高的线速度和低的浸入电解液的周期，以及一种装置。 金属跨越通过剃须板，然后穿过金属电镀溶液，通过包含金属氯化物，氟化物和硼酸的溶液的流体电连接器施加电压。 该方法用于对具有粘合金属层的金属板进行平板化，其提供延展性以促进挤出和低的，不发展的接触电阻。

    Process for production of printed circuit boards and use thereby
    6.
    发明授权
    Process for production of printed circuit boards and use thereby 失效
    生产印刷电路板的方法和使用

    公开(公告)号：US5617629A

    公开(公告)日：1997-04-08

    申请号：US424378

    申请日：1995-05-10

    Applicant: Bernt Ekstrom

    Inventor： Bernt Ekstrom

    IPC: B32B15/08 ,  C25D3/04 ,  C25D3/38 ,  C25D3/58 ,  C25D5/30 ,  H05K3/00 ,  H05K3/02 ,  H05K3/46

    CPC classification number: H05K3/025 ,  H05K2203/0152 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/068 ,  H05K2203/0723 ,  H05K2203/0726 ,  H05K2203/1536 ,  H05K3/4611 ,  H05K3/4652 ,  Y10T29/49155

    Abstract: The invention relates to a process for production of a copper clad, electrically insulated base for printed circuit boards, wherein a foil, of copper, copper alloy, aluminum or aluminum alloy by electroplating on preferably both sides furnished with a 1-35 .mu.m thick unpatterned layer of copper or copper alloy, is under heat and pressure laminated with the copper surfaces facing an electrically insulating, resin containing base. The copper layers are electroplated onto the foil in such a way that the layers after lamination strongly adhere to the insulating base and at the same time exhibit a very poor adhesion to the foil, which easily can be stripped from the copper layers without splitting these. The foil works during the lamination as a mold plate, whereby conventional mold plates can be excluded. The invention also comprises the use of such a copper clad foil as a combined mold plate and base for the copper layers during the lamination.

    Abstract translation: PCT No.PCT / SE93 / 00786 Sec。 371日期：1995年5月10日 102（e）日期1995年5月10日PCT提交1993年9月30日PCT公布。 公开号WO94 / 12008 日期：1994年5月26日本发明涉及一种用于印刷电路板的铜包覆电绝缘基底的制造方法，其中铜，铜合金，铝或铝合金的箔优选在两侧电镀， 35μm厚的铜或铜合金的未图案层被热和压力层压，铜表面面向电绝缘的含树脂的基底。 将铜层电镀到箔上，使得层压后的层牢固地粘附到绝缘基底上，同时对箔的粘附性非常差，从而易于从铜层剥离而不分离它们。 箔片在层压期间作为模板工作，由此可以排除常规的模板。 本发明还包括在层压期间使用这种铜包箔作为组合的模板和用于铜层的基底。

    Method for direct plating of iron on aluminum
    7.
    发明授权
    Method for direct plating of iron on aluminum 失效
    在铝上直接电镀铁的方法

    公开(公告)号：US5368719A

    公开(公告)日：1994-11-29

    申请号：US61353

    申请日：1993-05-12

    Applicant: Sue Troup-Packman

    Inventor： Sue Troup-Packman

    IPC: C25D3/20 ,  C25D5/30 ,  C25D5/44

    CPC classification number: C25D3/20 ,  C25D5/44

    Abstract: A process for plating aluminum and aluminum alloy substrates, such as 390 aluminum alloy pistons, with iron comprises (a) cathodically activating the aluminum-containing substrate in an acid bath and (b) plating iron from an iron sulfate-containing bath,

    Abstract translation: 一种用于电镀铝和铝合金基体如390铝合金活塞与铁的方法包括：（a）在酸浴中阴极活化含铝基底，（b）从含硫酸铁的浴中镀覆铁，

    Nickel-cobalt-boron-alloy deposited on a substrate
    8.
    发明授权
    Nickel-cobalt-boron-alloy deposited on a substrate 失效
    镍基钴合金在基材上沉积

    公开(公告)号：US5213907A

    公开(公告)日：1993-05-25

    申请号：US594570

    申请日：1990-10-09

    Applicant: Luis X. Caballero

    Inventor： Luis X. Caballero

    IPC: C22C19/00 ,  C25D1/04 ,  C25D3/56 ,  C25D5/26 ,  C25D5/28 ,  C25D5/30 ,  C25D15/00 ,  G02B5/08 ,  H01L21/288 ,  H01S3/08

    CPC classification number: H01S3/08068 ,  C25D3/562 ,  G02B5/08 ,  Y10S428/935 ,  Y10T428/12931 ,  Y10T428/12937 ,  Y10T428/12944 ,  Y10T428/12993

    Abstract: A dense, smooth, ductile, hard, highly reflective, corrosion-resistant, temperature resistant, and wear-resistant crystalline alloy of nickel, cobalt and boron. The alloy is epitaxially electrodeposited on an activated substrate using a pulsed square wave current. The epitaxial deposition occurs in an electrolytic bath containing nickel ions, cobalt ions, complexing agents, and an amino borane compound at a moderately low pH level and moderate temperature. An insoluble, solid catalyst, preferably palladium, causes the alloy to diffuse into the surface of the substrate and become bonded by a polar-covalent bond to it. Implements coated with the alloy, as well as plating solutions and methods for making the alloy are also disclosed.

    Abstract translation: 密实，光滑，延展，硬，高反射，耐腐蚀，耐温，耐磨和耐磨的镍，钴和硼晶体合金。 使用脉冲方波电流将合金外延电沉积在激活的基板上。 外延沉积发生在含有镍离子，钴离子，络合剂和氨基甲烷化合物的电解槽中，中等pH值和中等温度下。 不溶性固体催化剂，优选钯，导致合金扩散到基底表面，并通过极性共价键与其结合。 还公开了涂覆有合金的实施例，以及用于制造合金的电镀液和方法。

    Process for producing a magnetic recording material and article produced
    9.
    发明授权
    Process for producing a magnetic recording material and article produced 失效
    制造磁记录材料和制品的方法

    公开(公告)号：US4563397A

    公开(公告)日：1986-01-07

    申请号：US649299

    申请日：1984-09-11

    Applicant: Ikuo Ishiguro ,  Hiroyuki Nagao

    Inventor： Ikuo Ishiguro ,  Hiroyuki Nagao

    IPC: C25D5/30 ,  C25D11/12 ,  C25D11/18 ,  C25D11/20 ,  G11B5/84 ,  G11B5/858 ,  C25D9/06 ,  C25D9/08 ,  G11B5/62

    CPC classification number: C25D11/12 ,  C25D11/18 ,  G11B5/84 ,  G11B5/858 ,  Y10S205/922

    Abstract: Aluminum or an aluminum alloy on the surface of which an anodic oxide film comprising a porous layer and a barrier layer having micropores in the porous layer has been formed by a primary anodic oxidation treatment is subjected to a secondary anodic oxidation treatment and an immersion treatment so as to enlarge the pore diameter of the micropores, to make the cross-sectional profile of the micropores circular, and to make the thickness of the barrier layer and thus, the length of the micropores uniform, and subjecting the so treated aluminum or aluminum alloy to an electrolytic deposition treatment in an electrolytic bath containing a magnetic substance so as to uniformly allow a large amount of the magnetic substance to be deposited in the enlarged, uniform micropores, thereby obtaining a magnetic recording material having improved magnetic intensity and magnetic characteristics.

    Abstract translation: 通过初次阳极氧化处理，在其表面上具有包括多孔层的阳极氧化膜和在多孔层中具有微孔的阻挡层的铝或铝合金进行二次阳极氧化处理和浸渍处理 为了扩大微孔的孔径，使微孔的截面形状为圆形，并且使阻挡层的厚度，从而使微孔的长度均匀，并对经过处理的铝或铝合金 在包含磁性物质的电解槽中进行电解沉积处理，以便均匀地允许大量的磁性物质沉积在扩大的均匀微孔中，从而获得具有改善的磁强度和磁特性的磁记录材料。

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