Invention Grant
- Patent Title: Addition agent for copper plating
- Patent Title (中): 镀铜添加剂
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Application No.: US53755655Application Date: 1955-09-29
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Publication No.: US2774728APublication Date: 1956-12-18
- Inventor: WERNLUND CHRISTIAN J
- Applicant: DU PONT
- Assignee: Du Pont
- Current Assignee: Du Pont
- Priority: US53755655 1955-09-29
- Main IPC: C25D3/40
- IPC: C25D3/40
Information query
