Invention Grant
- Patent Title: Electrodeposition of copper and copper alloys
- Patent Title (中): 铜和铜合金的电沉积
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Application No.: US79182459Application Date: 1959-02-09
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Publication No.: US3111465APublication Date: 1963-11-19
- Inventor: FRANK PASSAL
- Applicant: M & T CHEMICALS INC
- Assignee: M & T Chemicals Inc
- Current Assignee: M & T Chemicals Inc
- Priority: US79182459 1959-02-09
- Main IPC: C25D3/40
- IPC: C25D3/40 ; C25D3/58
Information query
