Electroplating bath containing cuprous thiocyanate and cyanide and process of use

Invention Grant

US3179577A Electroplating bath containing cuprous thiocyanate and cyanide and process of use 失效

Title translation: 电镀浴中含有硫氰酸亚铜和氰化物及其使用过程

Patent Title: Electroplating bath containing cuprous thiocyanate and cyanide and process of use
Patent Title (中): 电镀浴中含有硫氰酸亚铜和氰化物及其使用过程
Application No.: US16530262

Application Date: 1962-01-10
Publication No.: US3179577A

Publication Date: 1965-04-20
Inventor: HADLEY ELBERT H
Applicant: UNIV SOUTHERN ILLINOIS
Assignee: Univ Southern Illinois
Current Assignee: Univ Southern Illinois
Priority: US16530262 1962-01-10
Main IPC: C25D3/40
IPC: C25D3/40

Public/Granted literature

Information query

Espacenet

IPC分类:

C	化学；冶金
C25	电解或电泳工艺；其所用设备
C25D	覆层的电解或电泳生产工艺方法；电铸（印刷电路的金属沉积法制造入H05K3/18）；工件的电解法接合；所用的装置（阳极或阴极保护入C23F13/00；单晶生长入C30B）
C25D3/00	电镀；其所用的镀液
C25D3/02	.溶液（C25D5/24至C25D5/32优先）
C25D3/38	..铜的
C25D3/40	...氰化物镀液