Invention Grant
- Patent Title: Diode assembly
- Patent Title (中): 二极管组件
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Application No.: US31178063Application Date: 1963-09-26
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Publication No.: US3231838APublication Date: 1966-01-25
- Inventor: SHARPLESS WILLIAM M
- Applicant: BELL TELEPHONE LABOR INC
- Assignee: Nokia Bell Labs
- Current Assignee: Nokia Bell Labs
- Priority: US31178063 1963-09-26
- Main IPC: H01P1/00
- IPC: H01P1/00
Information query
