Successively stacking, and welding circuit conductors through insulation by using electrodes engaging one conductor

Invention Grant

US3353263A Successively stacking, and welding circuit conductors through insulation by using electrodes engaging one conductor 失效

Title translation: 通过使用与一根导体接合的电极，绝缘层叠和焊接电路导体

Patent Title: Successively stacking, and welding circuit conductors through insulation by using electrodes engaging one conductor
Patent Title (中): 通过使用与一根导体接合的电极，绝缘层叠和焊接电路导体
Application No.: US38990064

Application Date: 1964-08-17
Publication No.: US3353263A

Publication Date: 1967-11-21
Inventor: DOUGLAS HELMS JOHN
Applicant: TEXAS INSTRUMENTS INC
Assignee: Texas Instruments Inc
Current Assignee: Texas Instruments Inc
Priority: US38990064 1964-08-17
Main IPC: H01L23/538
IPC: H01L23/538 ; H05K3/10 ; H05K3/32 ; H05K3/40 ; H05K7/06

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/52	.用于在处于工作中的器件内部从一个组件向另一个组件通电的装置
H01L23/538	..制作在绝缘衬底上或内的多个半导体芯片间的互连结构