Invention Grant
- Patent Title: Multiple contact mounting wafer
- Patent Title (中): 多种接触式安装方式
-
Application No.: US3487350DApplication Date: 1967-08-04
-
Publication No.: US3487350APublication Date: 1969-12-30
- Inventor: HAMMELL KEMPER MARTEL
- Applicant: AMP INC
- Assignee: AMP Inc
- Current Assignee: AMP Inc
- Priority: US65840867 1967-08-04
- Main IPC: F16B5/07
- IPC: F16B5/07 ; H05K1/18 ; H05K3/30 ; H05K3/34 ; H05K7/08 ; H05K7/10 ; H05K7/12 ; H05K1/00 ; H01R9/08
Information query
IPC分类:
