Invention Grant
- Patent Title: Miniature ultrasonic bonding device
- Patent Title (中): 微型超声波接合装置
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Application No.: US3670944DApplication Date: 1970-02-12
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Publication No.: US3670944APublication Date: 1972-06-20
- Inventor: DUSHKES SHERMAN Z , SURTY ROHINTON J
- Applicant: IBM
- Assignee: Ibm
- Current Assignee: Ibm
- Priority: US1096470 1970-02-12
- Main IPC: B23K20/10
- IPC: B23K20/10 ; B23K1/06 ; B23K5/20
Abstract:
An ultrasonic bonding system is arranged so that the magnetostrictive transducer is situated above and at right angles to a bonding tip. The transducer is held by a mounting means and lateral straps which are affixed at the node on the body of the transducer. The mounting means is above the transducer. The bonding tip is fastened directly to the transducer without intervening driver or horn.
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