公开(公告)号：US3670944A

公开(公告)日：1972-06-20

申请号：US3670944D

申请日：1970-02-12

申请人： IBM

发明人： DUSHKES SHERMAN Z ,  SURTY ROHINTON J

IPC分类号： B23K20/10 ,  B23K1/06 ,  B23K5/20

CPC分类号： B23K20/10

摘要： An ultrasonic bonding system is arranged so that the magnetostrictive transducer is situated above and at right angles to a bonding tip. The transducer is held by a mounting means and lateral straps which are affixed at the node on the body of the transducer. The mounting means is above the transducer. The bonding tip is fastened directly to the transducer without intervening driver or horn.

摘要翻译： 设置超声波接合系统，使得磁致伸缩传感器位于与接合尖端上方并成直角的位置。 传感器由安装装置和侧面带固定，固定装置固定在换能器主体上的节点处。 安装装置位于传感器的上方。 接合尖端直接固定在换能器上，无需驾驶员或喇叭。

公开(公告)号：US3405323A

公开(公告)日：1968-10-08

申请号：US62454967

申请日：1967-03-20

申请人： IBM

发明人： SURTY ROHINTON J ,  JAK TARANTO

IPC分类号： H01L23/42 ,  H01L23/473 ,  H01L25/03 ,  H05K7/20

CPC分类号： H01L23/42 ,  H01L23/473 ,  H01L25/03 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：US3576969A

公开(公告)日：1971-05-04

申请号：US3576969D

申请日：1969-09-02

申请人： IBM

发明人： SURTY ROHINTON J ,  TROLLMANN CONRAD

IPC分类号： B23K3/047 ,  H01L21/00 ,  H05K3/34 ,  B23K3/02 ,  H05B3/10

CPC分类号： H01L21/67144 ,  B23K3/0471 ,  H05K3/3421 ,  H05K3/3494 ,  Y10T29/49121 ,  Y10T29/49144 ,  Y10T29/49155

摘要： Disclosed is a device for simultaneously soldering numerous integrated circuit chip leads to a circuit board. The device is characterized by having a heating tip made of refractory, electrically insulative, thermally conductive, material. Fused to this tip is a coat of penetrating metallic paste. The paste is disposed on the tip in an electrically continuous path. Heating is accomplished by passing current through this metallic paste path.

公开(公告)号：US3458352A

公开(公告)日：1969-07-29

申请号：US3458352D

申请日：1966-08-15

申请人： IBM

发明人： DIETSCH HANS E ,  GOW JOHN ,  SURTY ROHINTON J

IPC分类号： H01C17/06 ,  F27D11/02 ,  H01C17/065 ,  H01C17/30 ,  H01B1/02 ,  B44D1/46 ,  C03C7/10

CPC分类号： H01C17/06533 ,  F27D11/02 ,  H01C17/065 ,  H01C17/30 ,  Y10T29/49099