公开(公告)号：US3670944A

公开(公告)日：1972-06-20

申请号：US3670944D

申请日：1970-02-12

Applicant: IBM

Inventor： DUSHKES SHERMAN Z ,  SURTY ROHINTON J

IPC: B23K20/10 ,  B23K1/06 ,  B23K5/20

CPC classification number: B23K20/10

Abstract: An ultrasonic bonding system is arranged so that the magnetostrictive transducer is situated above and at right angles to a bonding tip. The transducer is held by a mounting means and lateral straps which are affixed at the node on the body of the transducer. The mounting means is above the transducer. The bonding tip is fastened directly to the transducer without intervening driver or horn.

Abstract translation: 设置超声波接合系统，使得磁致伸缩传感器位于与接合尖端上方并成直角的位置。 传感器由安装装置和侧面带固定，固定装置固定在换能器主体上的节点处。 安装装置位于传感器的上方。 接合尖端直接固定在换能器上，无需驾驶员或喇叭。

公开(公告)号：US3653572A

公开(公告)日：1972-04-04

申请号：US3653572D

申请日：1969-09-05

Applicant: IBM

Inventor： DUSHKES SHERMAN Z ,  TROLLMANN CONRAD

IPC: B23K1/012 ,  B23K1/20

CPC classification number: B23K1/012

Abstract: Disclosed is a device for preparing solder coated leads for the final soldering operation. Excess solder is stripped from the solder coated leads by immersing these leads into streams of hot, dry gas. This stream of gas melts and flows away excess solder. A thin coating of solder is retained on the leads. The gas is preferably inert and the process takes place in a chamber which is substantially free of oxygen. This retained solder is ultimately used in the final bonding operation of the lead to a circuit board.

Abstract translation: 公开了一种用于制备用于最终焊接操作的焊料涂层引线的装置。 通过将这些引线浸入热干燥气体的流中，从焊接涂层引线剥离过量的焊料。 这股气体熔化并流出多余的焊料。 引线上保留有薄的焊料涂层。 气体优选是惰性的，并且该过程发生在基本上不含氧的室中。 这种保留的焊料最终用于引线到电路板的最终结合操作。