发明授权
- 专利标题： Microwave semiconductor device package
- 专利标题（中）： 微波半导体器件封装
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申请号： US41248673申请日： 1973-11-02
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公开(公告)号： US3898594A公开(公告)日： 1975-08-05
- 发明人: HOCHBERG ARTHUR KENNETH , HEJMANOWSKI RICHARD EDWARD
- 申请人： TRW INC
- 专利权人： Northrop Grumman Space and Mission Systems Corp
- 当前专利权人： Northrop Grumman Space and Mission Systems Corp
- 优先权： US41248673 1973-11-02
- 主分类号： H01L23/66
- IPC分类号： H01L23/66 ; H01L1/14 ; H01P1/00
摘要：
A package or mounting structure for hermetically sealing and supporting a microwave semiconductor device adapted for use with stripline transmission lines. A multilayer structure is assembled upon a conductive header, the elements of the multilayer structure having metallized surfaces thereon for providing contact to the microwave semiconductor device. The input and output leads to the mounting structure are adapted for use with strip transmission line configurations, the multilayer structure providing electrical and thermal conductive paths and including internal surface area for mounting microwave semiconductor devices and impedance matching components.
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