公开(公告)号：US3898594A

公开(公告)日：1975-08-05

申请号：US41248673

申请日：1973-11-02

申请人： TRW INC

发明人： HOCHBERG ARTHUR KENNETH ,  HEJMANOWSKI RICHARD EDWARD

IPC分类号： H01L23/66 ,  H01L1/14 ,  H01P1/00

CPC分类号： H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6644 ,  H01L2224/48 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A package or mounting structure for hermetically sealing and supporting a microwave semiconductor device adapted for use with stripline transmission lines. A multilayer structure is assembled upon a conductive header, the elements of the multilayer structure having metallized surfaces thereon for providing contact to the microwave semiconductor device. The input and output leads to the mounting structure are adapted for use with strip transmission line configurations, the multilayer structure providing electrical and thermal conductive paths and including internal surface area for mounting microwave semiconductor devices and impedance matching components.

摘要翻译： 一种用于密封和支撑适用于带状线传输线的微波半导体器件的封装或安装结构。 多层结构组装在导电集管上，多层结构的元件在其上具有金属化表面，用于提供与微波半导体器件的接触。 输入和输出导致安装结构适用于带状传输线配置，多层结构提供电和导热路径，并且包括用于安装微波半导体器件和阻抗匹配部件的内表面区域。

公开(公告)号：US3619731A

公开(公告)日：1971-11-09

申请号：US3619731D

申请日：1968-10-11

申请人： RCA CORP

发明人： BAKER LAWRENCE K ,  SHARDLOW LAWRENCE R

IPC分类号： H01L21/52 ,  H01L25/03 ,  H01L25/07 ,  H01L1/08 ,  H01L1/10 ,  H01L1/14 ,  H01L1/22

CPC分类号： H01L25/074 ,  H01L25/03 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device comprises a substrate, a first semiconductor pellet mounted on the substrate, an insulating material washer mounted on the first pellet, and a second semiconductor pellet mounted on the washer. The second pellet is rigidly secured to the washer and the first pellet, and electrically connected to the first pellet, by means of a solder filling the washer central opening and bonded to both pellets.

公开(公告)号：US3611555A

公开(公告)日：1971-10-12

申请号：US3611555D

申请日：1970-01-16

申请人： BOSCH GMBH ROBERT

发明人： NIER JOHANNES

IPC分类号： H01L21/00 ,  H01L21/60 ,  H01L23/488 ,  B01J17/00 ,  H01L1/14

CPC分类号： H01L24/31 ,  H01L21/00 ,  H01L23/488 ,  H01L24/28 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/014 ,  Y10T29/49142 ,  Y10T29/49144 ,  H01L2224/45099

摘要： A LAYER OF SOLDER IS PROVIDED ON A SURFACE PORTION OF A CARRIER. THE SOLDER LAYER IS THEN FORMED WITH A DEPRESSION WHOSE SIZE AND OUTLINE CORRESPOND TO THE SEMICONDUCTOR ELEMENT WHICH IS TO BE MOUNTED ON THE CARRIER, WHEREUPON THE SEMICONDUCTOR ELEMENT IS POSITIONED IN THE RECESS AND BONDED TO THE CARRIER BY SUBJECTING THE SOLDER TO REQUISITE THERMAL ENERGY.

公开(公告)号：US3559004A

公开(公告)日：1971-01-26

申请号：US3559004D

申请日：1969-01-28

申请人： SIEMENS AG

发明人： RAMBEAU HARRY ,  KIRSCHNER FRITZ

IPC分类号： H01L23/049 ,  H01L23/16 ,  H01L23/48 ,  H01L1/14

CPC分类号： H01L24/72 ,  H01L23/049 ,  H01L23/16 ,  H01L2924/01047 ,  H01L2924/09701 ,  H01L2924/1301 ,  Y10S257/926 ,  H01L2924/00

摘要： FIRST AND SECOND ELECTRICAL CONNECTORS PASS THROUGH THE HOUSING OF A SEMICONDUCTOR DEVICE IN A GAS-TIGHT MANNER AND ARE ELECTRICALLY INSULATED FROM THE HOUSING AND FROM EACH OTHER. THE FIRST CONNECTOR IS IN ELECTRICAL CONTACT WITH AN ELECTRICALLY CONDUCTIVE BODY AND WITH A FIRST CONTACT ELECTRODE OF THE SEMICONDUCTOR DEVICE VIA THE CON-

DUCTIVE BODY, A PLURALITY OF SPRING DISCS AND A PRESSURE MEMBER. THE SECOND CONNECTOR IS IN ELECTRICAL CONTACT WITH THE CONTROL ELECTRODE OF THE SEMICONDUCTOR DEVICE.

公开(公告)号：US3553499A

公开(公告)日：1971-01-05

申请号：US3553499D

申请日：1968-07-17

申请人： SPERRY RAND CORP

发明人： MAGUIRE HUGH C

IPC分类号： H03K3/335 ,  H03K17/041 ,  H01L1/14

CPC分类号： H03K3/335 ,  H03K17/04113

摘要： A transistor suitable for operation in the avalanche mode is connected in a switching circuit through coaxial lines. The outer conductors of the coaxial lines are electrically bonded to a base member and the center conductors of the coaxial lines are bored out to receive the ends of the transistor leads directly.

公开(公告)号：US3532942A

公开(公告)日：1970-10-06

申请号：US3532942D

申请日：1967-05-23

申请人： INT RECTIFIER CORP

发明人： BOYER JOHN L

IPC分类号： H01L23/051 ,  H01L23/36 ,  H01L25/03 ,  H01L25/07 ,  H01L1/14 ,  H01L1/16

CPC分类号： H01L25/074 ,  H01L23/051 ,  H01L23/36 ,  H01L25/03 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：US3518506A

公开(公告)日：1970-06-30

申请号：US3518506D

申请日：1967-12-06

申请人： IBM

发明人： GATES HARLAN R

IPC分类号： H01L23/29 ,  H01L23/485 ,  H01L27/06 ,  H01L29/00 ,  H01L1/14

CPC分类号： H01L23/485 ,  H01L23/291 ,  H01L23/585 ,  H01L24/11 ,  H01L27/0658 ,  H01L29/00 ,  H01L2224/05124 ,  H01L2224/05616 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/014

公开(公告)号：US3517278A

公开(公告)日：1970-06-23

申请号：US3517278D

申请日：1967-10-02

申请人： TELEDYNE INC

发明人： HAGER RICHARD W

IPC分类号： H01L21/60 ,  H01L1/14

CPC分类号： H01L24/80 ,  H01L24/81 ,  H01L2224/13144 ,  H01L2224/81801 ,  H01L2924/01013 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00

公开(公告)号：US3512053A

公开(公告)日：1970-05-12

申请号：US3512053D

申请日：1968-01-25

申请人： ASEA AB

发明人： ANDERSSON NILS ERIC ,  LILJA GORAN

IPC分类号： H01L23/48 ,  H01L23/488 ,  H01L1/14

CPC分类号： H01L24/72 ,  H01L23/488 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/1301 ,  H01L2924/00

公开(公告)号：US3512051A

公开(公告)日：1970-05-12

申请号：US3512051D

申请日：1965-12-29

申请人： BURROUGHS CORP

发明人： NOLL WALTER S

IPC分类号： H01L21/00 ,  H01L23/485 ,  H01L1/14

CPC分类号： H01L21/00 ,  H01L23/485 ,  H01L24/11 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05171 ,  H01L2224/05639 ,  H01L2224/16225 ,  H01L2924/00013 ,  Y10T29/49174 ,  H01L2224/29099 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/013 ,  H01L2924/01024