Invention Grant
- Patent Title: Tin-lead alloy plating
- Patent Title (中): 钛铅合金镀层
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Application No.: US54143275Application Date: 1975-01-16
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Publication No.: US3926749APublication Date: 1975-12-16
- Inventor: PASSAL FRANK
- Applicant: M & T CHEMICALS INC
- Assignee: M and T Chemicals Inc
- Current Assignee: M and T Chemicals Inc
- Priority: US54143275 1975-01-16; US21014871 1971-12-20
- Main IPC: C25D3/60
- IPC: C25D3/60 ; H05K3/34 ; C25D3/56
Abstract:
This invention relates to the electrodeposition of tin-lead alloys; tin-lead alloy plating compositions, tin-lead alloy plating baths; and to processes for the electrodeposition of tinlead alloys in the presence of at least one polyether surfactant and at least one aryl hydroxy (-OH) compound as cooperating additives.
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