Invention Grant
- Patent Title: Copper strike bath and method for coating electrolessly plated articles
- Patent Title (中): 铜冲洗浴和无电镀产品的涂覆方法
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Application No.: US48402374Application Date: 1974-06-28
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Publication No.: US3928148APublication Date: 1975-12-23
- Inventor: LERNER LEWIS BRIAN
- Applicant: AMP INC
- Assignee: AMP Inc
- Current Assignee: AMP Inc
- Priority: US48402374 1974-06-28
- Main IPC: C25D3/40
- IPC: C25D3/40 ; H05K3/24 ; C25D5/00
Abstract:
A copper strike electroplating bath comprising tetrapotassium pyrophosphate, potassium cyanide and cuprous cyanide. The strike is especially useful for plating on electroless metal deposits such as nickel.
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