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US3947953A Method of making plastic sealed cavity molded type semi-conductor devices 失效
制造塑料密封腔模制型半导体器件的方法

Method of making plastic sealed cavity molded type semi-conductor devices
摘要:
The external lead frame for a plastic sealed, cavity molded type semi-conductor device is formed of Phospor bronze, with the bronze lead frame liquid honed, it is pre-heated and supported in a mold cavity so as to be embedded into a powder epoxy resin molded header with improved sealing between the Phospor bronze lead frame in the header molded thereabove.
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