The invention relates to dental solder particularly suitable for joining parts of structural frameworks made of non-precious metal alloys, the framework being used in the preparation of bridges, crowns and the like. The solder compositions consist essentially of about 69 to 75% nickel, about 14 to 19.9% chromium, about 4 to 5.5% silicon and about 2.5 to 6% boron. The compositions may be modified to include up to about 6% molybdenum to increase corrosion resistance. The solder has a fusion temperature in the range of from about 1800.degree. to about 1950.degree. F and a diametrial tensile strength of at least 35,000 p.s.i. and a solder joint tensile strength of at least 70,000 p.s.i.