发明授权
- 专利标题： Method for mounting lead sockets to an electrical interconnection board
- 专利标题（中）： 将引线插座安装到电气互连板的方法
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申请号： US744135申请日： 1976-11-22
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公开(公告)号： US4089105A公开(公告)日： 1978-05-16
- 发明人: Herbert G. Yeo , John Nelson
- 申请人： Herbert G. Yeo , John Nelson
- 申请人地址： MA Attleboro
- 专利权人： Augat Inc.
- 当前专利权人： Augat Inc.
- 当前专利权人地址： MA Attleboro
- 主分类号： H01R12/58
- IPC分类号： H01R12/58 ; H01R43/20 ; H05K3/30 ; H05K13/04
摘要：
A method for mounting lead sockets in the holes in an electrical interconnection board. The lead sockets are hollow cylindrical elements having a tapered opening at one end and a plurality of normally converging flexible fingers at the other end. The lead sockets are force fitted into the holes in the board with the receptacle end of the socket opening into the component side of the board. The lead sockets are vibrated into place while a vacuum is applied to temporarily seat the lead sockets in the holes in the board. The lead sockets are then finally force fitted into the holes in the board by several alternative means. The apparatus for accomplishing the method of this invention is also disclosed.
公开/授权文献
- US06000908A Cooling for double-wall structures 公开/授权日：1999-12-14