发明授权
US4141030A High-power semiconductor assembly in disk-cell configuration 失效
大功率半导体组件在磁盘单元配置中

High-power semiconductor assembly in disk-cell configuration
摘要:
A high-power semiconductor assembly of the disk-cell construction has an insulating housing and exhibits electrical and thermal pressure-contacting of the semiconductor chip. At least two zones of different conduction types are provided within the chip and the same is clamped, in an essentially doubly symmetrical arrangement with respect to the mid-plane of the chip and the central axis perpendicular thereto, with the interposition of pressure plates, heat-conducting paste, and electrodes, particularly cup-shaped electrodes with their open sides disposed away from the main surfaces of the semiconductor chip, and between two terminal electrodes serving as heat sinks.
公开/授权文献
信息查询
0/0