发明授权
- 专利标题： Composite flanged ceramic package for electronic devices
- 专利标题（中）： 用于电子设备的复合法兰陶瓷封装
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申请号： US943487申请日： 1978-09-18
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公开(公告)号： US4227036A公开(公告)日： 1980-10-07
- 发明人: William Fitzgerald
- 申请人： William Fitzgerald
- 申请人地址： NJ Somerset
- 专利权人： Microwave Semiconductor Corp.
- 当前专利权人： Microwave Semiconductor Corp.
- 当前专利权人地址： NJ Somerset
- 主分类号： H01L23/057
- IPC分类号： H01L23/057 ; H01L23/08 ; H01L23/36 ; H01L23/373 ; H05K7/20
摘要：
An improved ceramic-based package for electronic devices having a composite flange for heat dissipation comprising a layer of heat conducting metal having a thermal coefficient of expansion appreciably different from that of the base secured to the base and a second layer of metal secured to the first layer having a thermal coefficient of expansion approximately equal to that of the ceramic. In a preferred embodiment, the first layer is copper, and the second is molybdenum.
公开/授权文献
- US5972176A Corona treatment of polymers 公开/授权日：1999-10-26