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US4435443A Method for forming a protecting film on side walls of a semiconductor device 失效
在半导体器件的侧壁上形成保护膜的方法

Method for forming a protecting film on side walls of a semiconductor
device
摘要:
A method for forming a protecting film on the side walls of a semiconductor device, e.g. a semiconductor laser, having an exposed PN junction at the side walls thereof is carried out by the following steps. The semiconductor device is placed on a substrate target made of a protecting film material. Energetic particles are impinged against the substrate target. Particles of the material are emitted from the substrate target and deposited on only the side walls to form the protecting film.
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