A condensation soldering facility (10) comprised of a housing (12) having a divider member (22) therein which separates the housing into a drying chamber (24) in an upper section and a soldering chamber (26) in a lower section. A transfer member (76) is pivotably mounted within the drying chamber (24) to receive articles (112--112) to be soldered through an access door (71) in the top of the drying chamber (24) and arcuately transfer the articles through an access door (44) in the divider member (22) to solder the articles in the soldering chamber (26).