发明授权
- 专利标题： Lead frame for plastic encapsulated semiconductor device
- 专利标题（中）： 塑料封装半导体器件引线框架
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申请号： US395799申请日： 1982-07-06
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公开(公告)号： US4482915A公开(公告)日： 1984-11-13
- 发明人: Mikio Nishikawa , Hiroyuki Fujii , Kenichi Tateno , Masami Yokozawa
- 申请人： Mikio Nishikawa , Hiroyuki Fujii , Kenichi Tateno , Masami Yokozawa
- 申请人地址： JPX Osaka
- 专利权人： Matsushita Electronics Corp.
- 当前专利权人： Matsushita Electronics Corp.
- 当前专利权人地址： JPX Osaka
- 优先权： JPX56-100697[U] 19810706; JPX56-107905 19810709
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/495 ; H01L23/30 ; H01L23/32 ; H01L21/60
摘要：
The invention provides a lead frame for a plastic encapsulated semiconductor device wherein one of the external leads connected to a first connecting band extends from one edge of a substrate support which supports a semiconductor substrate and also serves as a heat sink, two strips are connected to a second connecting band from the other edge of the substrate support, a notch is formed between the two strips of the second connecting band to allow proper positioning of the lead frame and to decrease thermal deformation during plastic encapsulation. Further, another lead frame is provided wherein a through hole is formed extending within the substrate support in the direction of thickness thereof in order to allow uniform flow of the resin and to form a thin resin layer on the rear surface of the substrate support.
公开/授权文献
- US5520480A Methods for laying roads 公开/授权日：1996-05-28