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    Lead frame for plastic encapsulated semiconductor device
    1.
    发明授权
    Lead frame for plastic encapsulated semiconductor device 失效
    塑料封装半导体器件引线框架

    公开(公告)号：US4482915A

    公开(公告)日：1984-11-13

    申请号：US395799

    申请日：1982-07-06

    申请人： Mikio Nishikawa ,  Hiroyuki Fujii ,  Kenichi Tateno ,  Masami Yokozawa

    发明人： Mikio Nishikawa ,  Hiroyuki Fujii ,  Kenichi Tateno ,  Masami Yokozawa

    IPC分类号： H01L23/31 ,  H01L23/495 ,  H01L23/30 ,  H01L23/32 ,  H01L21/60

    CPC分类号： H01L23/3107 ,  H01L23/3135 ,  H01L23/49562 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/181

    摘要： The invention provides a lead frame for a plastic encapsulated semiconductor device wherein one of the external leads connected to a first connecting band extends from one edge of a substrate support which supports a semiconductor substrate and also serves as a heat sink, two strips are connected to a second connecting band from the other edge of the substrate support, a notch is formed between the two strips of the second connecting band to allow proper positioning of the lead frame and to decrease thermal deformation during plastic encapsulation. Further, another lead frame is provided wherein a through hole is formed extending within the substrate support in the direction of thickness thereof in order to allow uniform flow of the resin and to form a thin resin layer on the rear surface of the substrate support.

    摘要翻译： 本发明提供了一种用于塑料封装的半导体器件的引线框架，其中连接到第一连接带的外部引线之一从支撑半导体衬底的基板支撑件的一个边缘延伸，并且还用作散热器，两个条带连接到 来自基板支撑件的另一边缘的第二连接带，在第二连接带的两个条带之间形成切口，以允许引线框架的适当定位并且在塑料封装期间减小热变形。 此外，提供另一个引线框架，其中形成在基板支撑件的厚度方向上延伸的通孔，以允许树脂均匀流动并在基板支撑件的后表面上形成薄树脂层。

    Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
    2.
    发明授权
    Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor 失效
    塑料封装半导体器件及其引线框架的制造方法

    公开(公告)号：US4451973A

    公开(公告)日：1984-06-05

    申请号：US367809

    申请日：1982-04-13

    申请人： Kenichi Tateno ,  Masami Yokozawa ,  Hiroyuki Fujii ,  Mikio Nishikawa ,  Michio Katoh ,  Fujio Wada

    发明人： Kenichi Tateno ,  Masami Yokozawa ,  Hiroyuki Fujii ,  Mikio Nishikawa ,  Michio Katoh ,  Fujio Wada

    IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L21/58

    CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/49562 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10T29/49121 ,  Y10T428/12194

    摘要： A method for manufacturing a plastic encapsulated semiconductor device is provided which comprises the steps of: clamping by upper and lower molds at least external leads and strips of a semiconductor device assembly formed using a lead frame which has a first connecting band connected to the external leads extending from one side of a substrate support further used as a heat sink, and a second connecting band connected to the strips having portions of small cross-sectional areas and of a predetermined length and extending from the other side of the substrate support, the cross sections being perpendicular to an extending direction of the strips, so that the substrate support may float in a cavity formed by the upper and lower molds and parts of the portions of small cross-sectional areas may be disposed in the cavity and the remaining parts thereof may be disposed between the upper and lower molds; injecting a plastic into the cavity; and cutting the portions of small cross-sectional areas of the strips which extend outside a plastic encapsulating housing along the end face of the plastic encapsulating housing and cutting a connecting portion between the external leads and the first connecting band.Also provided is a lead frame having the strips as described above.A plastic layer of desired thickness can be formed on the rear surface of the substrate support. Cutting of the strips from the plastic encapsulating housing is easy and reliable.

    摘要翻译： 提供了一种用于制造塑料封装的半导体器件的方法，其包括以下步骤：通过上模和下模至少夹紧外部引线和半导体器件组合带，所述半导体器件组件使用引线框形成，所述引线框具有连接到外部引线的第一连接带 从进一步用作散热器的基板支撑件的一侧延伸，以及连接到具有小横截面积和预定长度并且从基板支撑件的另一侧延伸的部分的条的第二连接带， 部分垂直于条的延伸方向，使得基板支撑件可以浮动在由上模具和下模具形成的空腔中，并且小横截面区域的部分的部分可以设置在空腔中，其余部分 可以设置在上模和下模之间; 将塑料注入腔内; 以及沿着所述塑料封装壳体的端面切割延伸到塑料封装壳体外侧的条的小横截面区域的部分，并切割外部引线与第一连接带之间的连接部分。 还提供了具有如上所述的条带的引线框架。 可以在基板支撑件的后表面上形成所需厚度的塑料层。 从塑料封装壳体切割条是容易和可靠的。