发明授权
US4491496A Enclosure for the treatment, and particularly for the etching of substrates by the reactive plasma method 失效
用于处理的外壳,特别是通过反应等离子体法蚀刻衬底

Enclosure for the treatment, and particularly for the etching of
substrates by the reactive plasma method
摘要:
Enclosure for the treatment of substrates by the reactive plasma method, consisting in a known manner of an inlet and an outlet (12) for the circulation of a reactive gas at low pressure, a base supporting the substrate (10) to be treated being placed between two electrodes, one of which (3) is at the ground potential and the other (4) or radio-frequency electrode is brought to an alternative potential such as to create an electrical discharge in the enclosure. It is characterized in that the enclosure is metallic and lined by plasma torch spraying with a protective coating (2) of alumina (Al.sub.2 0.sub.3) of a thickness of about 300 micrometers.
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