发明授权
- 专利标题: Growth substrate heating arrangement for UHV silicon MBE
- 专利标题(中): 用于特高压硅MBE的生长衬底加热布置
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申请号: US465800申请日: 1983-02-11
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公开(公告)号: US4492852A公开(公告)日: 1985-01-08
- 发明人: Sean N. Finegan , James H. McFee , Robert G. Swartz
- 申请人: Sean N. Finegan , James H. McFee , Robert G. Swartz
- 申请人地址: NJ Murray Hill
- 专利权人: AT&T Bell Laboratories
- 当前专利权人: AT&T Bell Laboratories
- 当前专利权人地址: NJ Murray Hill
- 主分类号: H01L21/203
- IPC分类号: H01L21/203 ; C30B23/06 ; H05B1/00 ; H01L21/20
摘要:
A substrate heating arrangement suitable for use in ultra-high vacuum MBE includes a filament responsive to a DC current for generating thermal energy, a metallic enclosure surrounding the filament and having an aperture at one end thereof, an intermediate semiconductor substrate parallel to and separated from a semiconductor growth substrate, and a substrate support mounted to the enclosure capable of holding the substrates in the prescribed relationship.The intermediate semiconductor substrate regulates the temperature on the surface of the semiconductor growth substrate to be less than or equal to a fixed temperature (approximately 1100.degree. C. for silicon) regardless of the DC current applied to the filament.
公开/授权文献
- US5018548A Segmented coupling for pipes 公开/授权日:1991-05-28
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