发明授权
US4538342A Forming platinum contacts to in-based group III-V compound devices 失效
与基于III-V族的复合器件形成铂触点

Forming platinum contacts to in-based group III-V compound devices
摘要:
Electrical contacts with low specific-contact resistance to In-based Group III-V compound semiconductors (e.g., p-InGaAsP) are formed by electron beam depositing a thin Pt layer directly on the semiconductor and sintering at about 450.degree.-525.degree. C. for about 5-30 minutes. Light emitting diodes without dark spot defects can be fabricated using this technique.
公开/授权文献
信息查询
0/0