发明授权
US4566913A Rapid thermal annealing of silicon dioxide for reduced electron trapping 失效
快速热退火二氧化硅减少电子捕获

Rapid thermal annealing of silicon dioxide for reduced electron trapping
摘要:
Silicon dioxide insulating films for integrated circuits are provided with enhanced electronic properties, including decreased water content and reduced trapping of electrons, by exposing a metal oxide semiconductor wafer including an exposed silicon dioxide layer, in an ambient of flowing inert gas, to heating radiation from a halogen lamp for a duration on the order of ten seconds to achieve annealing temperature in the range 600C.-800C.
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