An electroconductive film having moderate transparency and electroconductivity and excellent mechanical properties inclusive of a good tear strength is provided through a process wherein an electroconductive fiber is dispersed over a thermoplastic resin film, and the thus formed loosely laminated sheet is hot-pressed between a pair of rollers having temperatures above and below the softening point of the thermoplastic resin film, at least one of the rollers being surfaced with an elastic material. The electroconductive film is suitably used as a packaging material for shielding electromagnetic wave.