发明授权
- 专利标题： Electromigration lifetime increase of lead base alloys
- 专利标题（中）： 铅基合金的电迁移寿命增加
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申请号： US722631申请日： 1985-04-12
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公开(公告)号： US4622205A公开(公告)日： 1986-11-11
- 发明人: David P. Fouts , Devandra Gupta , Paul S. Ho , Jasvir S. Jaspal , James R. Lloyd, Jr. , James M. Oberschmidt , Kris V. Srikrishnan , Michael J. Sullivan
- 申请人： David P. Fouts , Devandra Gupta , Paul S. Ho , Jasvir S. Jaspal , James R. Lloyd, Jr. , James M. Oberschmidt , Kris V. Srikrishnan , Michael J. Sullivan
- 申请人地址： NY Armonk
- 专利权人： IBM Corporation
- 当前专利权人： IBM Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： B23K1/00
- IPC分类号： B23K1/00 ; B23K35/26 ; C22C1/00 ; C22C11/06 ; H01B1/02 ; H01B13/00
摘要：
Electromigration activity is decreased and lifetime is extended in solder stripes employed as conductors and terminals on microelectronic devices by forming an alloy of a solute element, such as copper, with tin in a lead/tin solder and providing a substantially uniform distribution of particles of the intermetallic compound in the solder. The concentration of the solute element is maintained at less than about three times the tin concentration and less than about 10% of the amount of the solder.
公开/授权文献
- US5844623A Television with integrated receiver decoder 公开/授权日：1998-12-01
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