An apparatus for applying adhesive or adhesive pastes in strips on construction or building surfaces comprising a heated hopper container for adhesive mounted on a traveling positive displacement pump, a manifold at the pump outlet provided with a plurality of moveable outlet openings and connected to separate conveying tubes and application nozzles, the positive displacement pump having a widened intake cross-section or a feed screw with a widened in-take cross-section and the hopper having a cylindrical upper section and a lower section conical in only one plane with a heatable screen grid in the transition point between the upper and lower hopper sections, the feed screw and the pump being at least partially heated, the drive shaft of the pump being provided with a safety crank and thermostatically controlled heating element and the hopper being provided with a closable by-pass carrying 2 or more individually or jointly, adjustable horizontally and vertically and elastically rotable slot nozzles mounted sliding on the base.