发明授权
- 专利标题: Semiconductor device
- 专利标题(中): 半导体器件
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申请号: US843614申请日: 1986-03-25
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公开(公告)号: US4672416A公开(公告)日: 1987-06-09
- 发明人: Shinji Nakazato , Hideaki Uchida , Nobuo Tanba , Nobuyuki Gotoo , Kazunori Onozawa , Atsushi Hiraishi
- 申请人: Shinji Nakazato , Hideaki Uchida , Nobuo Tanba , Nobuyuki Gotoo , Kazunori Onozawa , Atsushi Hiraishi
- 申请人地址: JPX Tokyo
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX60-58325 19850325
- 主分类号: H01L27/082
- IPC分类号: H01L27/082 ; H01L21/331 ; H01L21/8222 ; H01L21/8249 ; H01L27/06 ; H01L27/10 ; H01L29/73 ; H01L29/732 ; H01L27/02
摘要:
A semiconductor device facilitates keeping all parasitic resistance values between contact portion of a common source (V.sub.cc) line and intrinsic collector operation regions of respective transistors small enough so as not to exceed predetermined values and so as to be nearly identical. The parasitic resistance values are made small and nearly identical by disposing collector electrode connecting layers between base impurity introducing layers of respective transistors provided with predetermined intervals in a semiconductor substrate. Because of this arrangement to minimize and equalize resistances, the voltage drops generated by the parasitic resistances applied to respective transistors are suppressed so as to be lower than or not substantially exceed the operation threshold voltages of the parasitic transistors.
公开/授权文献
- USD347900S Laminated shingle 公开/授权日:1994-06-14
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