A feedthrough capacitor arrangement which comprises a frame having a first recess, printed circuit boards disposed in the vicinity of the frame, a feedthrough capacitor having an outer electrode and a central electrode placed in the first recess and a shield member for pressing the feedthrough capacitor placed in the first recess thereby to hold the feedthrough capacitor in association with the frame. In this arrangement, the outer electrode of the feedthrough capacitor is soldered to the frame and to the shield member while the central electrode is soldered to conductor patterns on the printed circuit boards.