发明授权
US4751126A A method of making a circuit board and a circuit board produced thereby
失效
制造电路板的方法和由此制成的电路板
- 专利标题： A method of making a circuit board and a circuit board produced thereby
- 专利标题（中）： 制造电路板的方法和由此制成的电路板
-
申请号： US881569申请日： 1986-07-02
-
公开(公告)号： US4751126A公开(公告)日： 1988-06-14
- 发明人: Hirosi Oodaira , Yoshikatsu Fukumoto , Shuji Hiranuma , Masayuki Ohuchi , Tamio Saito
- 申请人： Hirosi Oodaira , Yoshikatsu Fukumoto , Shuji Hiranuma , Masayuki Ohuchi , Tamio Saito
- 申请人地址： JPX Kawasaki
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX58-237804 19831219
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; H05K1/09 ; H05K1/16 ; H05K1/18 ; H05K3/00 ; H05K3/12 ; H05K3/22 ; H05K3/28 ; H05K3/40 ; H05K3/46 ; B05D5/10 ; B32B31/00
摘要：
A circuit board is prepared such that at least two resin substrates are laminated and bonded by thermocompression, a circuit pattern made of a resin composition containing a conductor material is formed on at least one of opposing surfaces of the substrates, a region of the substrate which corresponds to a specific portion of the circuit pattern is recessed, the specific portion of the circuit projects into the recess in accordance with plastic deformation of the substrates and the circuit pattern which is caused by thermocompression bonding, and the specific portion of the circuit pattern constitutes an exposed portion. Multilayer or three-dimensional wiring can be easily achieved in the circuit board.
公开/授权文献
信息查询
