公开(公告)号：US4754319A

公开(公告)日：1988-06-28

申请号：US97338

申请日：1987-09-11

申请人： Tamio Saito ,  Masayuki Ohuchi ,  Hirosi Oodaira ,  Yoshikatsu Fukumoto ,  Shuji Hiranuma ,  Ko Kishida ,  Takanori Kisaka

发明人： Tamio Saito ,  Masayuki Ohuchi ,  Hirosi Oodaira ,  Yoshikatsu Fukumoto ,  Shuji Hiranuma ,  Ko Kishida ,  Takanori Kisaka

IPC分类号： H01L27/00 ,  B32B37/18 ,  B42D15/10 ,  G06K19/077 ,  H01L23/00 ,  H01L23/28 ,  G06K19/06 ,  H01L23/06

CPC分类号： B32B37/185 ,  G06K19/07743 ,  G06K19/07745 ,  H01L2924/0002

摘要： In an IC card according to the present invention, a base sheet formed of thermoplastic material is sandwiched between a substrate sheet and a dummy sheet both formed of nonplastic material lower in thermoplasticity than the base sheet. The substrate sheet is fitted with at least one IC chip and input/output terminals electrically connected to the IC chip. First and second cover sheets formed of thermoplastic material are put individually on the outer surfaces of the substrate sheet and the dummy sheet. The cover sheet on the substrate sheet is formed with apertures through which the input/output terminals are exposed to the outside.

摘要翻译： 在根据本发明的IC卡中，由热塑性材料形成的基片夹在基片和虚拟片之间，所述基片和虚拟片由热塑性低于基片的非塑性材料形成。 该基板安装有至少一个IC芯片和与IC芯片电连接的输入/输出端子。 由热塑性材料形成的第一和第二覆盖片分别放置在基片和假片的外表面上。 基板上的盖板形成有孔，通过该孔将输入/输出端子暴露于外部。

公开(公告)号：US4751126A

公开(公告)日：1988-06-14

申请号：US881569

申请日：1986-07-02

申请人： Hirosi Oodaira ,  Yoshikatsu Fukumoto ,  Shuji Hiranuma ,  Masayuki Ohuchi ,  Tamio Saito

发明人： Hirosi Oodaira ,  Yoshikatsu Fukumoto ,  Shuji Hiranuma ,  Masayuki Ohuchi ,  Tamio Saito

IPC分类号： H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K1/18 ,  H05K3/00 ,  H05K3/12 ,  H05K3/22 ,  H05K3/28 ,  H05K3/40 ,  H05K3/46 ,  B05D5/10 ,  B32B31/00

CPC分类号： H05K1/186 ,  H05K3/281 ,  H05K3/4084 ,  H05K3/4614 ,  H05K3/4632 ,  H05K1/095 ,  H05K2201/0129 ,  H05K2201/091 ,  H05K2203/063 ,  H05K2203/1572 ,  H05K2203/302 ,  H05K3/0014 ,  H05K3/4007 ,  Y10S428/901 ,  Y10T156/1056 ,  Y10T156/109 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49167 ,  Y10T428/24339 ,  Y10T428/24347

摘要： A circuit board is prepared such that at least two resin substrates are laminated and bonded by thermocompression, a circuit pattern made of a resin composition containing a conductor material is formed on at least one of opposing surfaces of the substrates, a region of the substrate which corresponds to a specific portion of the circuit pattern is recessed, the specific portion of the circuit projects into the recess in accordance with plastic deformation of the substrates and the circuit pattern which is caused by thermocompression bonding, and the specific portion of the circuit pattern constitutes an exposed portion. Multilayer or three-dimensional wiring can be easily achieved in the circuit board.

摘要翻译： 制备电路板，使得至少两个树脂基板通过热压进行层压和接合，在基板的相对表面的至少一个表面上形成由包含导体材料的树脂组合物制成的电路图案，基板的区域 对应于电路图案的特定部分凹陷，电路的特定部分根据基板的塑性变形和由热压接而引起的电路图案突出到凹部中，并且电路图案的特定部分构成 曝光部分。 电路板可以容易地实现多层或三维布线。

公开(公告)号：US4997791A

公开(公告)日：1991-03-05

申请号：US508649

申请日：1990-04-13

申请人： Masayuki Ohuchi ,  Hirosi Oodaira ,  Kenichi Yoshida

发明人： Masayuki Ohuchi ,  Hirosi Oodaira ,  Kenichi Yoshida

IPC分类号： B42D15/02 ,  B42D15/10 ,  G06K19/077 ,  H01L21/00 ,  H01L21/60 ,  H01L21/603

CPC分类号： H01L24/96 ,  G06K19/07745 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24137 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/4913

摘要： An IC card comprises a thermoplastic resin core sheet and an IC chip bearing a conductive projection formed on an electrode of the IC chip, the IC chip being embedded in the core sheet in such a manner that the exposed top surface of the conductive projection is made flush with the main surface of the core sheet. A conductive layer pattern formed on the main surface of the core sheet is extended for contact with the exposed top surface.

公开(公告)号：US4694138A

公开(公告)日：1987-09-15

申请号：US677017

申请日：1984-11-30

申请人： Hirosi Oodaira ,  Haruko Suzuki ,  Masayuki Saito ,  Masayuki Ohuchi

发明人： Hirosi Oodaira ,  Haruko Suzuki ,  Masayuki Saito ,  Masayuki Ohuchi

IPC分类号： H01L21/48 ,  H01L23/538 ,  H05K1/09 ,  H05K3/10 ,  B23K26/00

CPC分类号： H05K3/105 ,  H01L21/4867 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19043 ,  H05K1/095 ,  H05K2203/107 ,  H05K2203/1131 ,  H05K2203/121 ,  Y10T29/49155

摘要： A conductor path is formed by providing an insulating substrate having a surface region which is formed of an insulating composition. The insulating composition contains an organic polymeric material and at least one metal source. The metal source is a metallic powder and/or an organic compound chemically combining a metal or metals. The surface region of the substrate is selectively heated along a predetermined pattern, thereby decomposing and evaporating the organic polymeric material at the heated portion and welding the metal in the heated portion so as to form a conductor path formed of the metal.

摘要翻译： 通过提供具有由绝缘组合物形成的表面区域的绝缘基板形成导体路径。 绝缘组合物含有有机聚合材料和至少一种金属源。 金属源是化学结合金属或金属的金属粉末和/或有机化合物。 衬底的表面区域沿着预定图案被选择性地加热，从而在加热部分分解和蒸发有机聚合物材料，并将金属焊接在加热部分中，以形成由金属形成的导体路径。

公开(公告)号：US4931853A

公开(公告)日：1990-06-05

申请号：US403772

申请日：1989-09-06

申请人： Masayuki Ohuchi ,  Hirosi Oodaira ,  Kenichi Yoshida

发明人： Masayuki Ohuchi ,  Hirosi Oodaira ,  Kenichi Yoshida

IPC分类号： B42D15/02 ,  B42D15/10 ,  G06K19/077 ,  H01L21/00 ,  H01L21/60 ,  H01L21/603

CPC分类号： H01L24/96 ,  G06K19/07745 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24137 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/4913

摘要： An IC card comprises a thermoplastic resin core sheet and an IC chip bearing a conductive projection formed on an electrode of the IC chip, the IC chip being embedded in the core sheet in such a manner that the exposed top surface of the conductive projection is made flush with the main surface of the core sheet. A conductive layer pattern formed on the main surface of the core sheet is extended for contact with the exposed top surface.

摘要翻译： IC卡包括热塑性树脂芯片和IC芯片，该IC芯片在IC芯片的电极上形成有导电突起，IC芯片以这样的方式嵌入在芯片中，使得暴露的导电突起的顶表面被制成 与芯片的主表面齐平。 形成在芯片的主表面上的导电层图案被延伸以与暴露的顶表面接触。

公开(公告)号：US4635356A

公开(公告)日：1987-01-13

申请号：US765800

申请日：1985-08-15

申请人： Masayuki Ohuchi ,  Hirosi Oodaira ,  Kenichi Yoshida

发明人： Masayuki Ohuchi ,  Hirosi Oodaira ,  Kenichi Yoshida

IPC分类号： H05K1/09 ,  H05K1/18 ,  H05K3/28 ,  H05K13/00 ,  H05K3/30

CPC分类号： H01L24/96 ,  H01L24/18 ,  H01L24/82 ,  H05K1/185 ,  H05K3/284 ,  H01L2224/18 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/095 ,  H05K2201/0108 ,  H05K2201/09118 ,  H05K2203/016 ,  H05K2203/1316 ,  H05K2203/1469 ,  H05K3/403 ,  H05K3/4611 ,  Y10T29/49146

摘要： Terminal-equipped electronic elements, such as chip resistors and chip diodes, are arranged such that one surface of each terminal contacts one surface of a support board, the support board being placed to face a flat plate through a spacer. An electrically insulative liquid synthetic resin is injected between the support board and the flat board and cured to form a synthetic resin layer burying the electronic elements. The support board, flat board and spacer are peeled from the electronic elements and the synthetic resin layer to expose one surface of the terminal of each electronic element on one surface of the synthetic resin layer. A conductive pattern is formed on the synthetic resin layer by screen printing to connect the terminals of the electronic elements.

摘要翻译： 端子配备的电子元件如片状电阻器和芯片二极管被布置成使得每个端子的一个表面接触支撑板的一个表面，支撑板通过间隔件放置成面对平板。 将电绝缘液体合成树脂注入支撑板和平板之间并固化以形成埋入电子元件的合成树脂层。 从电子元件和合成树脂层剥离支撑板，平板和间隔件，以在合成树脂层的一个表面上露出每个电子元件的端子的一个表面。 通过丝网印刷在合成树脂层上形成导电图案，以连接电子元件的端子。

公开(公告)号：US4572843A

公开(公告)日：1986-02-25

申请号：US697260

申请日：1985-02-01

申请人： Masayuki Saito ,  Haruko Suzuki ,  Hirosi Oodaira

发明人： Masayuki Saito ,  Haruko Suzuki ,  Hirosi Oodaira

IPC分类号： H01G4/33 ,  C04B41/51 ,  H01G4/008 ,  H01G4/10 ,  H05K1/16 ,  H01G1/01 ,  B05D3/06 ,  B05D5/12

CPC分类号： H01G4/008 ,  C04B41/51 ,  H05K1/16

摘要： A method for producing a capacitor includes the steps of: forming on a dielectric layer formed on a first electrode, an insulating composition, e.g., an organic polymeric compound containing a metal powder or an organometallic compound as a metal source, which is rendered conductive upon heating by radiation; and locally and gradually heating the insulating composition layer so as to form a second conductive electrode while measuring an increase in a capacitance between a conductor end portion for measuring a capacitance and the first electrode. According to this method, a capacitor having a precise capacitance can be formed.

摘要翻译： 一种制造电容器的方法包括以下步骤：在形成在第一电极上的电介质层上形成绝缘组合物，例如含有作为金属源的金属粉末或有机金属化合物的有机聚合物， 辐射加热; 并且在测量用于测量电容的导体端部与第一电极之间的电容的增加的同时，逐渐加热绝缘组合物层，从而形成第二导电电极。 根据该方法，可以形成具有精确电容的电容器。

公开(公告)号：US4704318A

公开(公告)日：1987-11-03

申请号：US838823

申请日：1986-03-12

申请人： Masayuki Saito ,  Hirosi Oodaira

发明人： Masayuki Saito ,  Hirosi Oodaira

IPC分类号： H01C17/065 ,  H01C17/242 ,  H05K1/03 ,  H05K1/05 ,  H05K1/09 ,  H05K1/16 ,  B32B3/00 ,  B32B15/08 ,  B32B27/32 ,  H05K1/00

CPC分类号： H01C17/065 ,  H01C17/242 ,  H05K1/056 ,  H05K1/032 ,  H05K1/095 ,  H05K1/16 ,  H05K2203/161 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31696 ,  Y10T428/31931

摘要： There is disclosed a wiring substrate comprising a wiring circuit pattern formed on a metal substrate with an insulating resinous layer interposed therebetween. In this wiring substrate, the insulating resinous layer is formed of a high molecular composition comprising thermosetting 1,2-polybutadiene containing 5 to 30% by weight of a high molecular softening agent such as hydrogenated polybutadiene. A method of manufacturing such a wiring substrate is also disclosed, wherein a light-reflecting pigment is included in the insulating resinous layer for the convenience of the subsequent laser trimming.

摘要翻译： 公开了一种布线基板，其包括在金属基板上形成有绝缘树脂层的布线电路图案。 在该布线基板中，绝缘树脂层由含有5〜30重量％的高分子软化剂如氢化聚丁二烯的热固性1,2-聚丁二烯的高分子组成形成。 还公开了一种制造这种布线基板的方法，其中为了便于后续的激光修整，在绝缘树脂层中包含光反射颜料。

公开(公告)号：US4584456A

公开(公告)日：1986-04-22

申请号：US530107

申请日：1983-09-07

申请人： Hirosi Oodaira ,  Haruko Suzuki ,  Masayuki Saito ,  Nobuo Iwase

发明人： Hirosi Oodaira ,  Haruko Suzuki ,  Masayuki Saito ,  Nobuo Iwase

IPC分类号： H01C17/00 ,  H01C17/20 ,  H01C17/22 ,  B23K26/00

CPC分类号： H01C17/00 ,  H01C17/20 ,  H01C17/22

摘要： A resistor is formed by locally heating an insulating material layer between conductors to convert the heated material into a first resistor element. A second resistor element is formed to contact the first resistor element while measuring the resistance between the conductors, until a desired resistor composed of the first and second resistor elements and having a predetermined resistance value is obtained.

摘要翻译： 通过局部加热导体之间的绝缘材料层形成电阻器，将加热的材料转换成第一电阻元件。 第二电阻元件形成为在测量导体之间的电阻的同时接触第一电阻元件，直到获得由第一和第二电阻元件组成并且具有预定电阻值的所需电阻。

公开(公告)号：US4412377A

公开(公告)日：1983-11-01

申请号：US341589

申请日：1982-01-21

申请人： Kenji Nagashima ,  Hiroshi Matsumoto ,  Masataka Tanaka ,  Hirosi Oodaira ,  Nobuo Iwase

发明人： Kenji Nagashima ,  Hiroshi Matsumoto ,  Masataka Tanaka ,  Hirosi Oodaira ,  Nobuo Iwase

IPC分类号： H05K3/44 ,  H01L21/48 ,  H01L23/14 ,  H01L23/373 ,  H01L25/16 ,  H05K1/05 ,  H05K3/22 ,  H05K3/28 ,  H05K3/34 ,  H01L21/84

CPC分类号： H05K3/22 ,  H01L21/4846 ,  H01L23/142 ,  H01L23/3735 ,  H01L25/16 ,  H01L2224/48227 ,  H05K1/053 ,  H05K2201/0116 ,  H05K2201/0179 ,  H05K2203/1147 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A method for manufacturing a hybrid integrated circuit device comprising a step of forming an Al.sub.2 O.sub.3 layer on a metal substrate, a step of forming on the Al.sub.2 O.sub.3 layer a resist layer having a pattern opposite to that of a copper layer which will be formed on the Al.sub.2 O.sub.3 layer by a later step, a step of forming the copper layer on the Al.sub.2 O.sub.3 layer using the resist layer as a mask, a step of impregnating thermosetting material into both the Al.sub.2 O.sub.3 layer and the copper layer, and a step of providing at least one semiconductor element on the copper layer.

摘要翻译： 一种制造混合集成电路器件的方法，包括在金属衬底上形成Al 2 O 3层的步骤，在Al 2 O 3层上形成具有与形成在Al 2 O 3上的铜层相反的图案的抗蚀剂层的步骤 使用抗蚀剂层作为掩模在Al2O3层上形成铜层的步骤，将热固性材料浸渍在Al 2 O 3层和铜层中的工序，以及提供至少一个半导体层 元素在铜层上。