发明授权
US4755631A Apparatus for providing an electrical connection to a metallic pad
situated on a brittle dielectric substrate
失效
用于向位于脆性电介质基片上的金属焊盘提供电连接的装置
- 专利标题： Apparatus for providing an electrical connection to a metallic pad situated on a brittle dielectric substrate
- 专利标题（中）： 用于向位于脆性电介质基片上的金属焊盘提供电连接的装置
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申请号： US27865申请日： 1987-03-19
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公开(公告)号： US4755631A公开(公告)日： 1988-07-05
- 发明人: Robert W. Churchwell , Philip L. Flaitz , James N. Humenik
- 申请人： Robert W. Churchwell , Philip L. Flaitz , James N. Humenik
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H05K1/00 ; H01R4/02
摘要：
Apparatus is described for providing an electrical connection to a metallic pad situated on a brittle dielectric substrate, such as a multi-layered ceramic (MLC) substrate, that reduces tensile stress occurring between the pad and the substrate.
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