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1.发明授权Method for use in brazing an interconnect pin to a metallization pattern situated on a brittle dielectric substrate 失效用于将互连针钎焊到位于脆性电介质基底上的金属化图案的方法
公开(公告)号：US4672739A
公开(公告)日：1987-06-16
申请号：US721885
申请日：1985-04-11
CPC分类号： H01L21/4853 , Y10T29/49149 , Y10T428/12542
摘要： A method for use in brazing an interconnect pin to a portion of metallization pattern (e.g. a pad) existing on a brittle dielectric substrate, such as a multi-layered ceramic (MLC) substrate, is disclosed. A dielectric layer is formed with appropriate annular openings. Each opening provides a closed containment wall, which extends around and above the pad, to hold the brazing alloy. Each circular containment wall is concentrically aligned with its associated pad and exposes an area, of each pad, having a smaller diameter than that of the entire pad. The containment walls serve to prevent the brazing alloy from coming into contact with any edge of the pads.
摘要翻译： 公开了一种用于将互连销钎焊到存在于脆性电介质基板（例如多层陶瓷（MLC）基板）上的金属化图案（例如，焊盘）的一部分的方法。 电介质层由合适的环形开口形成。 每个开口提供封闭的容纳壁，其围绕和移动焊盘延伸以保持钎焊合金。 每个圆形容纳壁与其相关联的垫同心地对齐，并且暴露每个垫的面积小于整个垫的直径的区域。 容纳壁用于防止钎焊合金与焊盘的任何边缘接触。
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2.发明授权Apparatus for providing an electrical connection to a metallic pad situated on a brittle dielectric substrate 失效用于向位于脆性电介质基片上的金属焊盘提供电连接的装置
公开(公告)号：US4755631A
公开(公告)日：1988-07-05
申请号：US27865
申请日：1987-03-19
CPC分类号： H01L21/4853 , Y10T29/49144 , Y10T29/49149 , Y10T428/12542
摘要： Apparatus is described for providing an electrical connection to a metallic pad situated on a brittle dielectric substrate, such as a multi-layered ceramic (MLC) substrate, that reduces tensile stress occurring between the pad and the substrate.
摘要翻译： 描述了用于提供与位于诸如多层陶瓷（MLC）基片之类的脆性电介质基底上的金属垫的电连接的装置，该多层陶瓷（MLC）衬底减小了衬垫和衬底之间产生的拉应力。
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