A semiconductor integrated circuit device includes basic semiconductor elements arranged regularly in lines and rows and located at intersecting points of the lines and rows and wiring conductor layers arranged among the basic semiconductor elements regularly in lines and rows. In this semiconductor integrated circuit device, according to a desired logic operation, wiring conductor layers are cut or contact holes are formed on the wiring conductor layers to form wiring metal layers and connect the basic semiconductor elements to one another, so that an integrated circuit chip capable of performing the desired logic operation is obtained.