发明授权
- 专利标题： Apparatus of multiplunger type for enclosing semiconductor elements with resin
- 专利标题（中）： 具有树脂封装半导体元件的多极型器件
-
申请号： US34946申请日： 1987-04-06
-
公开(公告)号： US4793785A公开(公告)日： 1988-12-27
- 发明人: Michio Osada
- 申请人： Michio Osada
- 专利权人： Michio Osada
- 当前专利权人： Michio Osada
- 优先权： JPX61-55057[U] 19860411; JPX61-113353 19860517
- 主分类号： B29C45/02
- IPC分类号： B29C45/02 ; B29C45/26 ; B29C45/40
摘要：
An apparatus of the multiplunger type having a stationary die and a movable die opposed thereto includes stationary and movable cavity blocks and ejector plates removably mounted on stationary and movable die bases, respectively. The lower one of the die bases is removably provided with a plunger holder on which plungers are arranged at an adjustingly variable spacing. The above components on the die bases are easily changeable, while the spacing between the plungers is readily adjustable to the spacing between the pots in the cavity block to be used upon a change. The apparatus is suited to the production of various kinds of semiconductor devices in small quantities.