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    Apparatus of multiplunger type for enclosing semiconductor elements with resin
    1.
    发明授权
    Apparatus of multiplunger type for enclosing semiconductor elements with resin 失效
    具有树脂封装半导体元件的多极型器件

    公开(公告)号：US4793785A

    公开(公告)日：1988-12-27

    申请号：US34946

    申请日：1987-04-06

    申请人： Michio Osada

    发明人： Michio Osada

    IPC分类号： B29C45/02 ,  B29C45/26 ,  B29C45/40

    CPC分类号： B29C45/2673 ,  B29C45/02 ,  B29C45/4005 ,  B29C2045/4052 ,  B29C2045/4094

    摘要： An apparatus of the multiplunger type having a stationary die and a movable die opposed thereto includes stationary and movable cavity blocks and ejector plates removably mounted on stationary and movable die bases, respectively. The lower one of the die bases is removably provided with a plunger holder on which plungers are arranged at an adjustingly variable spacing. The above components on the die bases are easily changeable, while the spacing between the plungers is readily adjustable to the spacing between the pots in the cavity block to be used upon a change. The apparatus is suited to the production of various kinds of semiconductor devices in small quantities.

    摘要翻译： 具有固定模具和与其相对的可动模具的多平台型装置包括分别固定和可移动的空腔模块和可拆卸地安装在固定和可移动模座上的顶出板。 模座的下一个可移除地设置有柱塞保持器，柱塞保持器以柱塞保持器的形式以可调节的间隔布置。 模具基座上的上述部件容易改变，而柱塞之间的间距容易地调节到空腔模块中的盆之间的间距，以便在更换时使用。 该装置适用于少量生产各种半导体器件。

    Apparatus for cleaning plastics forming mold faces
    2.
    发明授权
    Apparatus for cleaning plastics forming mold faces 失效
    用于清洁塑料成型模具面的装置

    公开(公告)号：US4543684A

    公开(公告)日：1985-10-01

    申请号：US543137

    申请日：1983-10-18

    申请人： Kazuo Bandoh ,  Michio Osada

    发明人： Kazuo Bandoh ,  Michio Osada

    IPC分类号： B29C33/00 ,  A47L9/04 ,  B08B1/04 ,  B29B13/00 ,  B29C33/72 ,  B30B15/00 ,  A47L5/02

    CPC分类号： A47L9/0483 ,  B08B1/04 ,  B30B15/0082

    摘要： An apparatus for cleaning plastics forming mold faces comprising composite brushes each consisting of a vibratory brush adapted to be vibrated in a vertical direction or in unspecified directions by a vibrating mechanism, and a rotary brush annularly surrounding the vibratory brush and adapted to be rotated in a horizontal direction, the composite brushes being disposed in opposed relation to the faces of two mold halves, a dirt sucking mechanism having a vacuum source for sucking and removing flash peeled from the mold faces by the vibratory and rotary brushes, and an air blowing mechanism for blowing air against the mold faces to cool the flash so as to enhance the flash peeling action of the vibratory and rotary brushes.

    摘要翻译： 一种用于清洁塑料成型模具面的装置，包括复合刷，每个复合刷由适于在垂直方向上或以未指定方向振动的振动刷由振动机构组成，旋转刷环绕着振动刷，并且适于在 水平方向，复合刷设置成与两个半模的表面相对;一个吸尘机构，具有用于吸收和去除由振动和旋转刷从模具表面剥离的闪光的真空源;以及一个用于 将空气吹向模具表面以冷却闪光，以增强振动和旋转刷的闪光剥离作用。

    Molding apparatus for enclosing semiconductor chips with resin
    3.
    发明授权
    Molding apparatus for enclosing semiconductor chips with resin 失效
    用树脂封装半导体芯片的成型装置

    公开(公告)号：US4723899A

    公开(公告)日：1988-02-09

    申请号：US796814

    申请日：1985-11-12

    申请人： Michio Osada

    发明人： Michio Osada

    IPC分类号： B29C45/02 ,  B29C45/77 ,  B29C31/06

    CPC分类号： B29C45/77 ,  B29C45/021 ,  B29C70/72

    摘要： A molding apparatus for enclosing semiconductor chips with resin has a plurality of plungers for applying pressure to a resin material, at least one transfer channel holding each of resin material supplying pots in communication with corresponding one of cavities for transferring the resin material in a molten state, a communication bore formed in the vicinity of the transfer channel in communication therewith, slide members each intimately fitting in the communication bore and slidable forward or backward, pressing-pushing members for pushing each slide member toward the corresponding transfer channel with a uniform pressure, and a pressure sensor operable by the retraction of each slide member for detecting the internal pressure of the transfer channel.

    摘要翻译： 用于用树脂封装半导体芯片的成型装置具有多个用于向树脂材料施加压力的柱塞，至少一个传送通道，其保持与相应的一个空腔连通的树脂材料供应罐，用于将树脂材料转移到熔融状态 形成在与其连通的传送通道附近的连通孔，每个紧密配合在连通孔中的滑动构件，可向前或向后滑动的推压构件，用于以均匀的压力朝向相应的传送通道推动每个滑动构件， 以及压力传感器，其可通过每个滑动构件的缩回操作，以检测传送通道的内部压力。